Infineon and Picovoice collaborate to bring AI to next generation IoT devices for smart home and wearable applications

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the company has collaborated with Picovoice to jointly develop an end-to-end voice platform that brings voice AI to edge devices. This collaboration enables smart voice solutions in ultra-low power IoT devices using Infineon’s PSoC(TM) 6 microcontrollers (MCUs). This gives designers an alternative approach to evaluating and deploying wake-phase and intent recognition on the company’s PSoC 6 products. The joint effort opens up new possibilities with on-device AI-enabled voice technology for the smart home and wearable applications using energy efficient PSoC 6 MCUs with comprehensive IoT connectivity support.

The Picovoice platform creates an accurate and private voice interface that is now easily used with existing Infineon PSoC 6 solutions including seamless pairing with AIROC(TM) Wi-Fi(R), low power CapSense(TM) touch interface and cloud connectivity. Leading in the highest sound quality capture, Infineon’s XENSIV(TM) MEMS microphones with industry’s lowest SNR, wide dynamic range, low distortions and high acoustic overload point are included in this platform.

Collaborating with Picovoice expands Infineon’s machine learning and AI ecosystem by allowing system developers using PSoC 6 the option to add a new voice feature for innovative IoT applications. Developers can now use a PSoC 6 Pioneer Development Kit and the IoT Sense Expansion Shield with an option to sign-up for a free Picovoice trial account. Additionally, they can run code examples using Infineon’s proven ModusToolbox(TM) to bring differentiated smart home and wearable applications to market.

About Infineon’s PSoC 6 MCUs

The PSoC 6 family is the perfect solution for secure, low-power, feature-rich IoT products. The family is built on an ultra-low-power architecture, including advanced low-power design techniques to extend battery life up to a full week for battery powered applications. The dual-core Arm(R) Cortex(R)-M4 and Cortex-M0+ architecture lets developers optimize for power and performance simultaneously. Using its dual cores combined with configurable memory and peripheral protection units, PSoC 6 enables Platform Security Architecture (PSA) level 2 certified MCUs.

Designers can use the MCU’s rich analog and digital peripherals to create custom analog front-ends (AFEs) or digital interfaces for innovative system components such as MEMS sensors, electronic-ink displays. Through comprehensive software support available in ModusToolbox, PSoC 6 MCUs, pair seamlessly with Infineon’s AIROC Wi-Fi, AIROC Bluetooth(R), or AIROC combos radio modules. The PSoC 6 MCUs feature the latest generation of industry-leading CapSense capacitive-sensing technology, enabling modern touch and gesture-based interfaces that are robust and reliable.

Availability

The Infineon PSoC 62S2 Wi-Fi BT Pioneer Kit and the IoT Sense Expansion Shield are available now. The kit includes a PSoC 62 150-MHz Arm Cortex-M4 and 100-MHz Arm Cortex-M0+ cores, 2 MB of Flash, 1 MB of SRAM, the Murata Type 1LV module, that provides IEEE 802.11a/b/g/n-compliant, IEEE 802.11 ac-friendly Wi-Fi with integrated Bluetooth 5.0, the Infineon XENSIV MEMS microphones and several other sensors.

Infineon makes the IoT work

Microelectronics make up the core of every IoT solution. Infineon’s sensors, actuators, microcontrollers, communication modules, and security components underpin every device. The company is a one-stop technology partner for realizing smart, energy-efficient, and secure IoT applications with development boards, evaluation kits, and design tools additionally supporting manufacturers. More information about Infineon’s contribution to IoT: www.infineon.io.

Photo: https://mma.prnewswire.com/media/1666682/Voice_control.jpg
Caption: The Infineon and Picovoice end-to-end voice platform creates an accurate and private voice interface that is now easily used with existing Infineon PSoC(TM) 6 solutions including seamless pairing with AIROC(TM) Wi-Fi(R), low power CapSense(TM) touch interface and cloud connectivity. Leading in the highest sound quality capture, Infineon’s XENSIV(TM) MEMS microphones with industry’s lowest SNR, wide dynamic range, low distortions and high acoustic overload point are included in this platform

Source:  PRNewswire/InfoQuest